Compact Magnetron Sputter System
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- pvd, sputter, magnetron sputter
- Category
- Other Machinery & Industry Equipment
A-Tech System, Inc.
- Country / Year Established
-
South Korea
/
- Business type
- Others
- Verified Certificate
-
12
| Product name | Compact Magnetron Sputter System | Certification | - |
|---|---|---|---|
| Category | Other Machinery & Industry Equipment | Ingredients | - |
| Keyword | pvd , sputter , magnetron sputter | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips, new materials, nanomaterials, and sample preparations, etc.
Special Features
RF or DC magnetron sputter for multipurpose R&D.
RF to DC power supply easily changed without hardware change.
Deposition available for various materials of metals, carbon materials, metal oxides and metal nitrides, etc.
Small space needed for installation.
Efficient deposition through easy operation.
High performance to low cost.
Target shutter, view port shutter and chamber liners installed.
Ar gas introduced between cathode shield and target for high sputter yield.
Reactive sputtering also available.
Specifications
Target size: 2in to 3in
System control: PLC-based touch panel
Substrate holder size: normally up to 3in wafer
Substrate heating: basically not heated or water-cooled (optionally heated up to 300oC)
Bias plasma applied to substrate holder (optional)
Target to substrate distance: 60 to 100mm controllable
Sputter power supply: 600W RF power supply(13.56MHz) with matching circuit (DC power optional)
Process gas: Ar, O2 (N2 optional)
Vacuum gauge: low and high vacuum gauges
Base pressure: <5.0E-6Torr
Pumping system of TMP (51 l/s)+rotary oil pump(200 l/min) (dry pump is optionally available)
Water: <20oC, 2kg/cm2, 20l/min
Compressed air: 5kg/cm2
Weight: 100kg
Dimension: 561mm(W) x 548mm(D) x 519mm(H)
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Cho, Young Sang
- Address
- 175-25, Cheongcheon-Dong 2, Bupyeong-Gu, Incheon, 403-853, Rep. Korea
- Product Category
- Machinery & Parts
- Company introduction
-
Developed itmes
- Ion beam source
- Arc source
- Filtered cathodic vacuum arc system and process
- LPCVD for nanotube synthesis
- Silica PECVD system
- UHV(Ultra High Vacuum) sputtering system
- Silica TCP (Transformer Coupled Plasma) etcher
- UHV-sputter system for ferromagnetic multilayers
- Vacuum arc system for nitrides deposition
- In-line system of vacuum arc deposition for protecting PDP
electrodes
- High vacuum test system for a flat light source evaluation
- Multifunctional standard sputtering system for R&D
- NPPN(New Post Plasma Nitriding) System
- Sputter for polygon mirror applicable to laser printer
- Production scale of arc ion plating (AIP) system
- Ion beam sputter for precision optics
- Production scale of AIP and NPPN systems
- Ion plating system for various coloration
- Pilot scale of arc discharge equipment for CNT transparent electrode
sputter web coater for flexible display research
- Sputter system for ophthalmic
- Polycrystalline silicon ingot growing equipment
- PECVD system for anti-reflective coatings on solar cell
- PECVD system for graphene deposition
- Al plasma nitriding equipment for mass production with KAITECH
- Equipment of carbon nanotube using electrical arc discharge method
- Graphene PECVD-PVD Cluster equipment
- Main Product
