Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips, new materials, nanomaterials, and sample preparations, etc.

Special Features

RF or DC magnetron sputter for multipurpose R&D.
RF to DC power supply easily changed without hardware change.
Deposition available for various materials of metals, carbon materials, metal oxides and metal nitrides, etc.
Small space needed for installation.
Efficient deposition through easy operation.
High performance to low cost.
Target shutter, view port shutter and chamber liners installed.
Ar gas introduced between cathode shield and target for high sputter yield.
Reactive sputtering also available.

Specifications

Target size: 2in to 3in
System control: PLC-based touch panel
Substrate holder size: normally up to 3in wafer
Substrate heating: basically not heated or water-cooled (optionally heated up to 300oC)
Bias plasma applied to substrate holder (optional)
Target to substrate distance: 60 to 100mm controllable
Sputter power supply: 600W RF power supply(13.56MHz) with matching circuit (DC power optional)
Process gas: Ar, O2 (N2 optional)
Vacuum gauge: low and high vacuum gauges
Base pressure: <5.0E-6Torr
Pumping system of TMP (51 l/s)+rotary oil pump(200 l/min) (dry pump is optionally available)
Water: <20oC, 2kg/cm2, 20l/min
Compressed air: 5kg/cm2
Weight: 100kg
Dimension: 561mm(W) x 548mm(D) x 519mm(H)