Yujin Tech is a company that performs metalizing business and waterjet processing business.

1. Metallizing Business

Ceramic Metallizing technology, which is being pursued by our company, is a technology to metalize a certain surface of ceramic inorganic material and to join various metals (Steel, Cu, Sus.).

It is a technology used to make parts important to the electrical, electronic, and mechanical industries that require electrical insulation.

There are Kyocera, Toshiba and Panasonic in Japan and KCC, Ssangyong and Korea Electronics Materials in Korea.

However, there is no domestic company that has the technology that can directly produce our developed products.

Due to this, most of the metalizing products in Korea are dependent on imports.

Mo-Mn-Metallizing, W-Metallizing and Ag- We believe that we can expand our business by developing similar items using three types of metalizing technology.

We acquired the technology in 2002 in Toshiba, Japan, and we have manufacturing technology based on 15 years of manufacturing experience (Magnetron, EV Relay).

1) Processing

If the metal paste is printed or applied on some or all of the ceramics (92%, 96%, 99%) and subjected to a reducing atmosphere sintering process, the area done blazing on the ceramic is metalized.

2) Metalizing material : Ceramic 92%, 96%, 99%, Zirconia

3) Bondable material : Cu, Kovar, Steel, Other metals

4) Metal Paste : Mo-Mn, Silver

5) Method of bonding : Brazing, soldering

6) galvanizing : Electroplating, electroless chemical plating (Ni-B, Ni-P)

7) Applications : Products requiring high vacuum, Ceramic substrate circuit, Heater electrode, Plasma circuit etc.

8) Product Features : High strength bonding, Equal metalizing thickness, reliable vacuum sealing

- Metalizing available material - 

1. Ceramic 92%

2. Ceramic 96%

3. Ceramic 99%

4. Zirconia

- Bondable Material - 

1. Copper

2. Nickel

3. Aluminum

4. Kovar

5. Steel

- Bonding Method -

1. Brazing

2. Soldering

- Plating processing -

1. Electroplating

2. Chemical Electroless Plating (Ni-B , Ni-P)