MIS Co., Ltd. is a Manufacturing Company producing Semiconductor tester machines. We developed a Encapsulation Machine, Which removes automatically EMC(Epoxy Molding Compound) of Packaged semiconductor chips without any damage of wire bonds. When the examined packaged chip is judged to have defects, the Encapsulation process determines the defects in a semiconductor whether it was blemished in the packaging process or the wafer process. Our Decipher Machines makes it possible to open the packaged chip quickly and it automates the whole process of opening the failed chip. - Computer GUI All the functions and operations are controlled by Graphic User interface using Computer. - Accuracy 0.01mm Milling Accuracy of the milling depth. MIS auto Decipher detects the height automatically using sensor. MIS Auto Decipher can test various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm. - Convenient Operation User can easily find and use a best automatic process using recipe files stored in a database. User can easily create new recipe and edit it. Milling, Chemical process, Cleaning, Inspection, Storing of digital images, Checking of Machine settings or errors can be easily executed by GUI. - Safety MIS Auto Decipher secures the safety from the acid gas evaporation using gas exhauster and it use the minimum chemicals. - Dispensing MIS Auto Decipher has a special pump, which can inject Fuming Nitric Acid, Fuming Sulfuric Acid or Sulfuric Acid by 0.005cc(Min.) to remove the Epoxy Molding Compound of a chip. - Various Handling IC MIS Auto Decipher uses various chemical dosing methods and this makes it possible to decamp various package types such as BGA, DIP, QFP, CSP, TSOP, PBGA, Most of package types. - Speedy process MIS Auto Decipher can remove the EMC of various chips faster than before. Usually BGA type takes tome not more than 20 minutes and NON-BGA type can be executed within 15 minutes. - No Need of Gasket MIS Auto Decip