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Silicone Potting Encapsulants Compound Glue

Silicone Potting Encapsulants Compound Glue

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Place of Origin: China

Brand name: LEED-INK

Payment Terms: L/C,Others,T/T,Western Union

Production method: Negotiable

Shipping / Lead Time: Negotiable / Negotiable

Keyword: silicone potting adhesive, silicone potting glue, silicone encapsulating adhesive, silicone encapsulating glue

Category: Other Chemicals , Electronic Products & Components Processing , Silicone Sealants

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Hunan LEED Electronic Ink Co., Ltd.

Membership: BIZ

Country / Year Established: China / 2008

Business type: Manufacturer

Verified Certificate: 9

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PRODUCT DESCRIPTION COMPANY INFORMATION Related Products

Product name	Silicone Potting Encapsulants Compound Glue	Certification	-
Category	Other Chemicals Electronic Products & Components Processing Silicone Sealants	Ingredients	-
Keyword	silicone potting adhesive , silicone potting glue , silicone encapsulating adhesive , silicone encapsulating glue	Unit Size	37.0 * 27.0 * 12.0 cm
Brand name	LEED-INK	Unit Weigh	6 kg
origin	China	Stock	-
Supply type	-	HS code	350691

Product Information

Silicone Potting Encapsulant EG-F026R | EG-F008G

Description

LEED-INK silicone encapsulant is a two-components room curing silicone thermal conductivity encapsulant. It is designed for long-term protection of precision electronic equipment and components in electronic industry. It is especially suitable for the sealing of electronic circuit boards and components in bad environment(such as moisture, shock and corrosive place, etc.) and the heat dissipation of high power components.

Benefits

1. High thermal conductivity, high and low temperature resistance(-40℃-250℃)

2. Rapid curing time, and the curing time is adjustable

3. Good adhesivity with materials such as metal, plastics,etc.

Typical Properties

Test	Properties
	EG-F026R			EG-F008G
Mixing Ratio	1:1			1:1
Color	A	B	A+B	A	B	A+B
Viscosity (mPa.S) (Brookfield HBT,10rpm,25℃)	White	Red	Red	White	Gray	Gray
Room Temperature Operable Time (h)	80,000	40,000	60,000	3,500	4,000	4,000
Room Temperature Operable Time (h)	24			24
Heating Curing Time (h)	100℃/15min			100℃/15min
Density (g/cm 3 )	2.54			1.50
Hardness (shore A)	60			42
Operating Temperature (℃)	-40℃-250℃			-40℃-250℃
Thermal Conductivity (W/m.K	2.60			0.80
Volume Resistance (Ω·cm)	10 14			10 14

Applications

The silicone encapsulant is applied to the sealing and heat dissipation of the electronic circuit board and components, to achieve insulation, moisture and shock proof.

Usage

1) Component A and component B should use special tools separately. Do not use the tools in

mixture.

2) Separately stir component A and component B fully and evenly before using.

3) Mix according to A:B=1:1, and stir it over 15min to ensure the mixing uniformity of component A and B.

4) After mixing, deaerate the paste in vacuum equipment with 10min before potting. To ensure the potting quality, it is recommended to deaerate again after potting. If no deaeration, please put the product with 30min in room

temperature before heating and curing.

5) Please finish 3) and 4) within operating time(8h).

6) Curing could be done by 80℃/15min, or 24h in room temperature.

Delivery and Storage

During transportation and storage should protect against the tide and contamination. Containers may be stored in a cool dark, dry and stable environment at room temperature, with their lids tightly sealed. The shelf life of the

paste is 12 months. The used material should be collected and sealed up alone. Don’t mix with other untapped material. Pay attention to prevent moisture and impurities infiltration.

Package

The general package is 1KG/Plastic jar, 5KGS/Plastic bucket, and 25KGS/Plastic bucket.

Product Info Attached File: Silicone Encapsulant TDS.pdf

B2B Trade

Price (FOB)	Negotiable	transportation	-
MOQ	Negotiable	Leadtime	Negotiable
Payment Options	L/C,Others,T/T,Western Union	Shipping time	Negotiable

Hunan LEED Electronic Ink Co., Ltd.

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Country / Year Established: China / 2008

Membership: BIZ

Business type: Manufacturer

President: Mr. Wenmin Ning

Address: Bldg2,No.8 Jinlong Rd, Tianyuan District, Zhuzhou, Hunan, China

Product Category: Agrochemicals & Pesticides,Other Chemicals,Other Electronic Components,Printing Inks

Year Established: 2008

No. of Total Employees: 51-100

Company introduction: As a high-tech enterprise in Hunan, Hunan LEED Electronic Ink Co., Ltd (hereafter called LEED-INK) specializes in development, production and sales of electronic pastes for more than ten years. The company focus on R&D, puts service at first, and pursues excellence. All products follow the idea of environmental protection and energy conservation. In order to serve our customers better, all products are tested under the same conditions with them.

LEED-INK has undertaken National 863 High Tech Program, National SME Innovation Fund Project, and other key science and technology projects. To improve the strength of R&D, the company also established technical cooperation with colleges and universities. With a number of invention patents, LEED-INK owns series of electronic pastes products with proprietary intellectual property rights.

LEED-INK has established a perfect management system, in which there is R&D department, production department, quality control department, marketing department and operating department. The company also has a sound quality control and environment management system. All products are in strict accordance with the standards of production and inspection processes in order to ensure the stability of product quality. The company passed ISO9001:2004 and ISO14001:2008 quality system authentication. All the pastes are environmentally friendly, and have been in line with ROHS standard.