MTCA, Mega Thermal Conductive Adhesive, Gel, Black
(TIM-MTCA : Thermal Interface Material Mega Thermal Conductive Adhesive)

│What is the Mega Thermal Conductive Coat (MTCC) with graphene│

• Mega heat-resistant inorganic binder by sol-gel method and silicate inorganic binder with high viscosity, Heat dissipation material with mega heat-resistance (max. 800℃) and high adhesive property (2MPa) as conductive inorganic adhesive mixed with mega conductive graphene material.
  
  
• Heat dissipated graphene adhesive of thermal interface material, TIM1 type (heat-sink, sapphire wafer and LED) and TIM2 type (adhesion between PCB and heat sink) with high efficiency conductivity, which are using Oxidation-Chemical method, first in world, separated oxidation film from graphene film.
  
  
• TIM-MTCA, graphene heat dissipation adhesive with high performance, which are differentiated from heat dissipated adhesive using conventional aluminum material, Carbon Fiber, Graphite and CNT, and pure inorganic material (max. 800 ℃).

│Properties of conductive graphene heat dissipation adhesive (TIM-MTCA)│

• Mega conductive graphene heat dissipation adhesive using Chemical-Oxidation separation method, easy mass production.
• Heat conductivity above 50~100W/m.K with 20~30um(0.02~0.03mm) thickness.
• Insulating heat dissipation adhesive using pure inorganic material
• High stability in acid and alkali, heat resistance of max. 800 ℃.
• Shield function to prevent disturbance of electromagnetic wave
• Adhesive function of metal, nonmetal, plastic, FRP, carbon fabric, textile, film and glass

│Comparison ; TIM-MTCA vs. conventional adhesive│

• Need for high heat-resistance & high heat dissipation adhesive
  
  - 95% of conventional heat dissipation material is organic and inorganic compound. High conductive filler material has high thermal conductivity, but, adhesive strength is low. Polymer has good adhesive strength, but, low thermal conductivity (0.5~5W/m.k)
  
  - the temperature range of organic or organic/inorganic compound is below 300℃, and it is difficult to use in high temperature range.
  
  
• Need for simple system to construct the heat-dissipation structure
  
  - heat-dissipation adhesive of Ecoinfra use graphene as a super high thermal conductive filler.
  - inorganic binder with high viscosity and high adhesive strength, by sol-gel method, is used.
  - high heat-resistant & heat-dissipation adhesives which can be used in high heated system

│Convenience of high heat-resistant& heat-dissipation adhesives│

• Graphene heat-dissipation adhesive with heat-resistant property above 800℃
  
  - high heat-resistant and heat-dissipation adhesive of liquid type;
  - graphene material of high heat-resistant + inorganic binder of high adhesive
  - applied to metal, nonmetal, alloy, FRP, textile, glass, film and concrete
  
  
• Graphene heat-dissipation adhesive to easy construct heat-dissipation system with high efficiency
  
  - high thermal conductivity, 50~100W/m.K / RT curing adhesive above 2MPa (adhesive strength)/pure inorganic material with no smell & eco-friend