The New Technology of  Heat Sink for Cooling of LED Module Used Nano Silver Glue

1. High Performance of Heat Sink for Cooling.
2. High Reliability.
3. High Efficiency of COB.
4. Various Application Field

Module Type	Thermal Resistance Characteristics	Thermal Conduct
	~40 K/W	Chip ~PACKAGE : 0.5~3w/mk Package~PCB : 3~5w/mk PCB~Heatsink : 3~5w/mk
General LED
	~10 K/W	Chip ~PACKAGE : 0.5~3w/mk PCB~Heatsink : 3~5w/mk
COB LED
	~ 1 K/W	Chip ~PACKAGE : 200w/mk PCB~Heatsink : 400w/mk
GEM LED Module

Compare Gem’s Product with Module of Other Companies

• Improve the thermal conductivity  more than 50 times in LED Module
• Process temperature is below 300 degrees Celsius
• The Nano Silver Glue has high heat conductivity about 200~400w/mk

Differentiation of Technology Used the Nano Silver Glue

• Small size and High Power.
• It can apply the high power module.
• It can apply a rated current more than 2 times in same chip.
• This can reduce cost by reduced quantity of LED Chips.
• Extend the life-time for low junction temperature.
• This product has superior adhesive stren
• Application is Ship, Plan, Train ect.
• Silver Process Temperature is below 300 degrees Celsius.
• Thermal Resistance of COB is below 1.0 K/W
• This can be used in various ways