CMP Slurry Abrasive
Negotiable Min Order Quantity Unit
- Required Quantity
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- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- Category
- Other Chemicals
Bestchem International Co., Ltd.
- Country / Year Established
- South Korea /
- Business type
- Others
- Verified Certificate
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Product Information
CMP Slurry Abrasive
In the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer. In CMP process, the semiconductor substrate is polished by metal-oxide slurry using elastomer pad. According to the substrate, the process is consists of ILD, STI, and metal CMP. Generally, metal-oxide slurry for CMP is in need of stable dispersion, high removal rate, less defect such as scratch on the surface after polishing, high purity chemicals.
KONASIL is superior to this application for highly pure silicon dioxide, uniform particle size and proper size distribution.
B2B Trade
Price (FOB) | Negotiable | transportation | - |
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MOQ | Negotiable | Leadtime | Negotiable |
Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Brian Kim
- Address
- 1327HO, HYUNDAI WORLD TOWER, 77 MOKDONGSEO-RO, YANGCHEON-GU, SEOUL 158-735, KOREA
- Product Category
- Other Minerals & Metallurgy Products,Other Plastic Raw Materials,Styrene Butadiene Rubber
- Company introduction
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