CMP Slurry Abrasive

CMP Slurry Abrasive


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Other Chemicals

Bestchem International Co., Ltd.

Country / Year Established
South Korea South Korea /
Business type
Others
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14

DUNS

Product name CMP Slurry Abrasive Certification -
Category Other Chemicals Ingredients -
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Product Information

CMP Slurry Abrasive

In the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer. In CMP process, the semiconductor substrate is polished by metal-oxide slurry using elastomer pad. According to the substrate, the process is consists of ILD, STI, and metal CMP. Generally, metal-oxide slurry for CMP is in need of stable dispersion, high removal rate, less defect such as scratch on the surface after polishing, high purity chemicals.

KONASIL is superior to this application for highly pure silicon dioxide, uniform particle size and proper size distribution.

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Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

Bestchem International Co., Ltd.

Country / Year Established
South Korea South Korea /
Business type
Others

14

DUNS

President
Brian Kim
Address
1327HO, HYUNDAI WORLD TOWER, 77 MOKDONGSEO-RO, YANGCHEON-GU, SEOUL 158-735, KOREA
Product Category
Other Minerals & Metallurgy Products,Other Plastic Raw Materials,Styrene Butadiene Rubber
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