KB 1631 HTC-1
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- India
- Payment Terms
- T/T
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Category
- Epoxy Adhesives
Kohesi Bond
- Verified Certificate
-
7
Product name | KB 1631 HTC-1 | Certification | - |
---|---|---|---|
Category | Epoxy Adhesives | Ingredients | - |
Keyword | bonding , nasa low outgassing , two component epoxy , high thermal conductivity epoxy | Unit Size | - |
Brand name | - | Unit Weigh | - |
origin | India | Stock | - |
Supply type | - | HS code | - |
Product Information
Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.
KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +200°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications.
Packaging : Cans, Pails
B2B Trade
Price (FOB) | Negotiable | transportation | - |
---|---|---|---|
MOQ | Negotiable | Leadtime | Negotiable |
Payment Options | T/T | Shipping time | Negotiable |
- President
- Utsav Shah
- Address
- 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S. Marg, Bhandup West, Mumbai - 400078
- Product Category
- Epoxy Adhesives
- Year Established
- 2015
- No. of Total Employees
- 51-100
- Company introduction
-
<p>Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. In November 2014, we started prototyping as a part of an interdisciplinary effort with the Institute of Chemical Technology, bringing together a team of technical experts to formulate specialty adhesive systems. Through persistent research, technical know-how and groundbreaking innovation we were able to create new compounds that had truly distinguished properties. In September 2015, we founded Kohesi Bond to further our research and manufacture first-rate, industry-ready products in our state of the art facility.
To deliver reliable solutions, we realised that one size does not fit all. Hence, our focus has been on offering tailor-made products, consistent quality and unparalleled expertise to our customers. We want to keep innovating new products with diverse chemistries that add more value to every application. By researching, formulating and testing each product all under the same roof, we are able to take a holistic approach to manufacturing exclusive adhesives and provide customers with an end-to-end solution.
- Main Product