Hybrid Micro-AIS(F)

Evaluational equipment of

Mechanical properties,

Residual stress,

Thickness testing and

Electrolytic polishing at Micro-scale

│Powerful Functions│

• Non-destructive residual stress and tensile properties evaluation
• Seamless integration with IIT
• Application of ISO / TR29381
• Application of KS B0950 / KS B0951 (Korean standards)
• Application of KEPIC MDF A370 code

※ Hybrid Tester at micro-scale

The Hybrid Micro-AIS(F) is an All-in-one Measurement Solution System allowing the variety of test operations such as the evaluation of mechanical properties, verification of construction, thickness measurement and others in one device system by putting and integrating the instrumented indentation test, thickness measurement, surface treatment and test inspection technologies together.

- Items

• Residual stress
• Vickers hardness
• Tensile strength
• Electrolytic polishing
• Ultrasonic thickness
• Surface inspection
• 
  

- Specification

<Thickness Testing Module>

<Electrolytic Polishing Module>

<Surface Inspection System>

※Hybrid Micro-AIS(F)

- Features

• Evaluation of tensile property and residual stress with Instrumented Indentation Test
• Determination of thinning presence for test target through thickness measurement
• Chemical polishing of sectional area
• Observation of minute construction of test target
• All-in-one software

- Application 

• Fragile sections of turbines and vessels in hydro / thermal power plants and petrochemical plants
• Minute areas affected by welding on boiler tubes and heat transfer pipes
• Equipment components with small sizes and thin thickness
• Test of mechanical property and quality for surface heat treatment equipment and components