Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white grap

Material of Boron Nitride Ceramics

• Pyrolytic Boron Nitride： 99.99% Boron Nitride*
• 99 Boron Nitride: Boron Nitride + Boric Oxide(B2O3)
• CABN: Boron Nitride + Calcium Borate
• ALBN: Boron Nitride + Al2BO3
• ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide(B2O3)
• ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3
• SCBN: Boron Nitride + Silicon Carbon + Al2BO3

Processing of Boron Nitride Ceramics

• Hot Pressed Sintering
• Chemical Vapor Deposition

Applications of Boron Nitrides Ceramics

• Thermal Management
  Excellent electrical insulation and thermal conductivity makes BN very useful as a heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and easier machinable to desired shapes and sizes .
• High Temperature Environments
  Temperature stability and excellent resistance to thermal shock makes BN as the ideal material in the toughest high temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.
• Molten Metal Handling
  BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.

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