Aluminum oxide, Al2O3 sputteirng target, thin film coating material
Negotiable Min Order Quantity Unit
- Required Quantity
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- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- aluminum oxide, evaporation, sputtering target, thin film
- Category
- Industrial Supplies , Semiconductors , Oxide
Huizhou Tian Yi Rare Material Co.,Ltd
China
- Verified Certificate
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10
| Product name | Aluminum oxide, Al2O3 sputteirng target, thin film coating material | Certification | - |
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Industrial Supplies
Semiconductors Oxide |
Ingredients | - |
| Keyword | aluminum oxide , evaporation , sputtering target , thin film | Unit Size | - |
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| Supply type | - | HS code | - |
Product Information
Aluminum oxide, Al2O3, CAS# 1344-28-1
Aluminum oxide, Al2O3 material from TYR as following
High pure Aluminum oxide, Al2O3 powder, purity: 99.99%, 99.999%, Size: -325 mesh e.t.c
High pure Aluminum oxide, Al2O3 ceramic sputtering targets, purity: 99.99%, Shape: discs, disks, step disk, delta, plate, sheet, tube or made as requested
High pure Aluminum oxide, Al2O3 ceramic evaporation material, purity: 99.99%, Shape: granules, pieces, chunks, pellets Spec.: 1-12mm or made as requested
High pure Aluminum oxide, Al2O3 crystal evaporation material, purity:99.99%, Shape: granules, pieces, chunks, pellets Spec.: 1-12mm or made as requested
High pure Aluminum oxide, Al2O3 doped element sputtering targets, evaporation material: purity: 99.99%, AZO,Al2O3-ZnO, Al2O3-Sb2O3, ATO, Al2O3-MgO e.t.c
Density 3.95–4.1 g/cm3 , Melting point 2072 °C (3,762 °F; 2,345 K), Boiling point 2977 °C (5,391 °F; 3,250 K), Solubility in water insoluble
Al2O3 is an electrical insulator but has a relatively high thermal conductivity (30 Wm−1K−1[1]) for a ceramic material. Aluminum oxide is completely insoluble in water. In its most commonly occurring crystalline form, called corundum or α-aluminum oxide, its hardness makes it suitable for use as an abrasive and as a component in cutting tools.
Aluminum oxide is responsible for the resistance of metallic aluminum to weathering. Metallic aluminum is very reactive with atmospheric oxygen, and a thin passivation layer of aluminum oxide (4 nm thickness) forms on any exposed aluminum surface. This layer protects the metal from further oxidation. The thickness and properties of this oxide layer can be enhanced using a process called anodizing. A number of alloys, such as aluminum bronzes, exploit this property by including a proportion of aluminum in the alloy to enhance corrosion resistance. The aluminum oxide generated by anodizing is typically amorphous, but discharge assisted oxidation processes such as plasma electrolytic oxidation result in a significant proportion of crystalline aluminum oxide in the coating, enhancing its hardness.
Applications: Filler, Catalysis, Purification, Abrasive, Paint, electrical insulator
The great majority of aluminum oxide is consumed for the production of aluminum, usually by the Hall process.
Using a plasma spray process and mixed with titania, it is coated onto the braking surface of some aluminium bicycle rims to provide abrasion and wear resistance
Charged Aerosol Release Experiment (CARE) , Corundum , List of alumina refineries , Micro-Pulling-Down , Ruby , Sapphire , Transparent alumina
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
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| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Amy Chiu
- Address
- 12 K of Shiji, Shijixingtian Bldg, YanDa Road, Huizhou, China
- Product Category
- Industrial Supplies,Other Minerals & Metallurgy Products,Semiconductors
- No. of Total Employees
- 1-50
- Company introduction
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TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds. we offer targets bonding service, we serving government research establishments, universities and high technology industries. We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first. Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent. Sputtering Targets Materials list: High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ; Alloy Sputtering Targets: Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-Ag Cu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-Ni Co alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-Pt Ni alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V, Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co Ta alloy targets: Ta-Al, Ta-W W alloy targets: W-Ti, W-Mo, W-B, W-Re Mo alloy targets: Mo-Nb, Mo-Si, Mo-Al Fe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.c Ceramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO) Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2 Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3 Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnS Selenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe Silicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
- Main Markets
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Egypt
France, Metropolitan
Germany
Hong Kong(China)
India
Japan
South Korea
U. Kingdom
U.S.A
- Main Product
