Semiconductor etchingmachine(semiautomatic)(non-standard equipment)

General description:suitable for etching of 2 "- 8"wafer.Conversionbetween corrosiongrooves andcleaninggrooveis driven byimported SEW

1.Object: wafer cleaning

2 (1)the ultrasonic cleaning, heating cleaning for single slottiming control, to give the end tone.

(2)The process: material,supported ionic water ultrasonic cleaning, deionized waterheating and cleaning, deionized water washing, cutting

3 Features: this equipment is cabinet type, the operating side has a transparent window.

4 Channel material is German imports of polypropylene(PP magnetic white board), welded with SS outsourcing 5mm thick German magnetic white board PP, beautiful in appearance.

5 Ultrasonic cleaning equipment, heating time by the timercontrol.

6 Heating tank is provided with a temperature control table(pompon) and sensor.

7 Each cleaning tank is independent. water supply for ultrasonic cleaning tank (Flushing cleaning tankequipped with hot water), drainage is manual .

8 Equipped with adjustable exhaust device type.

9 Equipped with USA imported nitrogen gun.

10 The electric control part adopts a sealing protection way with the emergency shutdown and alarm device.