TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds. we offer targets bonding service, we serving government research establishments, universities and high technology industries. We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first. Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent. Sputtering Targets Materials list: High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ; Alloy Sputtering Targets: Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-Ag Cu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-Ni Co alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-Pt Ni alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V, Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co Ta alloy targets: Ta-Al, Ta-W W alloy targets: W-Ti, W-Mo, W-B, W-Re Mo alloy targets: Mo-Nb, Mo-Si, Mo-Al Fe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.c Ceramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO) Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2 Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3 Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnS Selenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe Silicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe