Auto Solder Ball Placement System BPS-6200FC
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Category
- Semiconductors
SSP INC
- Country / Year Established
-
South Korea
/
- Business type
- Others
- Verified Certificate
-
11
| Product name | Auto Solder Ball Placement System BPS-6200FC | Certification | - |
|---|---|---|---|
| Category | Semiconductors | Ingredients | - |
| Keyword | semiconductor packaging , solder ball mounting | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Features
- - Automatic device set?up and calibration
- - PRS (Pattern Recognizing System) Cameras to improve precise strip position
- - Pre?Align Station: Package centering on boat mechanical aligner and servo motor
- - Automatic magazine & strip width adjustment (Auto Conversion)
- - Auto ball volume control and auto ball supply system
- - Flux blade position is controlled by step motor for high speed fluxing.
- - Ball quality vision system with high resolution 5Mega CCD camera before offloading.
- - Reject unit sorter system (optional)
- - Unit Flipper on the Boat (optional)
| Description | Specification |
|---|---|
| Cycle Time | Half Boat 12~15 sec. / Boat Base 23~25 sec. |
| Yield Performance | 99/99% |
| UPH | 1400units/6up based on half boat, 2800units/12up based on half boat, and 3000units/21up based on boat. |
| Placement Accuracy | +/? 0.03mm |
| Fine Pitch Capability | 0.30mm ball size & 0.5mm pitch |
| Product Flexibility | All kinds of flip chip BGA on boat and BGA package on laminated substrate |
| Quick Conversion Time | (Less than 10 min) Ball tool, Flux tool, Vacuum Block (for different body size) |
| Foot Print and Weight | 2700 x 1750 x 1870 mm / 2900 Kg |
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- KH LEE
- Address
- 82B-9L NAMDONG INDUSTRIAL COMPLEX, GOJAN-DONG 679-8, NAMDONG-GU, INCHEON, KOREA
- Product Category
- General Industrial Equipment
- No. of Total Employees
- 1-50
- Company introduction
-
Our company's philosophy is to provide our customers with highly improved products and specialized service in time. We SSP work hard to develop advanced technology experts through professional training programs and study. We do our best to prove that SSP is the reliable company by maintaining high technology and conducting constant research and development. Since 1996, SSP has been manufacturing semiconductor package equipments which enable easy operation, perfect quality concept, and the service system with speedy action according to customer's point of view. SSP considers customers as our first priority and this will be the best value now and forever. We will do our best to meet our customer's technological needs having prospect for the future. We're growing to be the strong company with both high technology and sincere service for customers. Thank you very much.
- Main Markets
-
China
Malaysia
Philippines
South Korea
- Main Product
