Wafer Thinning
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- Category
- Wires & Cables
- Country / Year Established
-
South Korea
/
- Business type
- Others
- Verified Certificate
-
16
| Product name | Wafer Thinning | Certification | - |
|---|---|---|---|
| Category | Wires & Cables | Ingredients | - |
| Keyword | - | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Features
Wafer thinning technology is recognized as one of core technologies in semiconductor
industry, which facilitates smartcard and RFID chips and also enables MCP (Multi
Chip Package) and SCSP (Stacked Chip Size Package) requisitely used for compact
but multifunctional electronic mobile devices such as DMB phones, PDAs and PMPs.
Our wafer thinning solution can help customers take cutting-edge technology
leadership in these areas.
Our thinning technology can satisfy the needs, while meeting the demands for
thicknesses of 0.8t or 0.6t currently required or to-be-shortly required by
market.
Premium advantages of our new chemical etching solution
are;
- Broad range of feasible thickness from 150㎛ to 25㎛
- Zero warpage with smooth edge
- Superior TTV
- High strength of wafer dies
- Mirror surface (RA: less than 0.02㎛)
- Applicable to bump wafer
- SSD (Sub Surface Damage) eliminated
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
