Features

Wafer thinning technology is recognized as one of core technologies in semiconductor industry, which facilitates smartcard and RFID chips and also enables MCP (Multi Chip Package) and SCSP (Stacked Chip Size Package) requisitely used for compact but multifunctional electronic mobile devices such as DMB phones, PDAs and PMPs.

Our wafer thinning solution can help customers take cutting-edge technology leadership in these areas.

Our thinning technology can satisfy the needs, while meeting the demands for thicknesses of 0.8t or 0.6t currently required or to-be-shortly required by market.

Premium advantages of our new chemical etching solution are;

• Broad range of feasible thickness from 150㎛ to 25㎛
• Zero warpage with smooth edge
• Superior TTV
• High strength of wafer dies
• Mirror surface (RA: less than 0.02㎛)
• Applicable to bump wafer
• SSD (Sub Surface Damage) eliminated