Back Grind Adhesive Tape
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- Category
- Packing Sealing Adhesive Tapes
AMC Co., Ltd.
South Korea
- Verified Certificate
-
16
| Product name | Back Grind Adhesive Tape | Certification | - |
|---|---|---|---|
| Category | Packing Sealing Adhesive Tapes | Ingredients | - |
| Keyword | - | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Features
- ImprovingTTVValue
- PreventDustandWaferPenetration
- AbsorbingMechanicalstress
| Model Name | AP130-SC | APB1 | APB7 | AU130-SC | ||||||
| Structure | Base Film | Polyolefin | Polyolefin | EVA | Polyolefin | |||||
| Adhesive | Acryl | Acryl | Acryl | Acryl | ||||||
| Thickness (um) |
Total | Base film | 130 | 110 | 130 | 110 | 240 | 200 | 130 | 110 |
| Adhesive | 20 | 20 | 40 | 20 | ||||||
| Protection Film | 38 | 38 | 38 | 38 | ||||||
| Physical property | Tensile Strength (N/mm2) |
20 | 20 | 25 | 20 | |||||
| Elogation(%) | 800 | 800 | 900 | 900 | ||||||
| Adhesion (gf/25mm) |
Before UV irradiation | 150 | 100 | 400 | 330 | |||||
| After UV irradiation | 30 | |||||||||
| Application | Non-UV type | Non-UV type | Non-UV type | UV type | ||||||
| Note 1) Test Method : JIS Z 0237 / KS A 1107 Note 2) The product could be modified by customer's request |
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- An, Yong-kuk
- Address
- 497 Docheong-ri, Geumwang-eup, Eumseong-gun, Chungcheongbuk-do
- Product Category
- Electronic Products & Components Processing,Other Electronic Components
- Year Established
- 1996
- No. of Total Employees
- 1-50
- Company introduction
-
Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the semiconductor wafer for backgrinding and dicing.
- 2004 Perform SMBA Innovation Mission (Sole)-Completed.
- 2004 Perform CIE Part & Material Mission( Joint)-Completed.
- 2005 Perform SMBA Innovation Strategy Mission (Joint) -Completed
- 2005 Perform CIE Part & Material Innovation Mission (Joint)-Completed
- 2005 Commission of Specialist of Part & Materials against Korea & Japan FTA
- 2007 Nominated as Part and Materials Mission by CIE
- 2009 Perform CIE Part & Material Mission -Completed
- Main Markets
-
Belarus
China
Malaysia
Taiwan
U.S.A
- Main Product
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