Image Sensor Chip -NeoPAC

Image Sensor Chip -NeoPAC


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Keyword
Category
Digital Cameras

OPTOPAC Inc

Membership
BIZ
Country / Year Established
South Korea South Korea / 2003
Business type
Manufacturer
Verified Certificate

16

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Product name Image Sensor Chip -NeoPAC Certification -
Category Digital Cameras Ingredients -
Keyword - Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -

Product Information

NeoPAC® is the name of our patented image sensor chip scale package
Conventional camera module has been used COB(Chip on board) structure which is connecting electrical signals between sensor die pads and PCB pads by using gold bonding wire.
NeoPAC is a new style of package structure which is using solder joint between electro copper plated glass substrate and lead free solder bumped sensor dies. Meanwhile, electrical connection between the package and PCB made through outer solder balls on the glass substrate

NeoPAC® Advantages

  1. Low cost, high volume producible chip scale package solution which using proven semiconductor technology and equipments.
  2. High cum yield by assembling good sensor die and good glass window.
  3. High reliability image sensor SCP fulfills JEDEC MSL1
  4. Slim and smaller size compared to previous conventional package solutions.
  5. Capability of optical filter coating at the top and bottom side of glass substrate slim module solution
  6. Accurate co-planarity between sensor image surface and glass top surface ±5um control, easier to control image uniformity in camera module.
  7. Lowest clearance tolerance between image surface and glass top ±8um
  8. Low image plane height after SMT 0.14~0.16mm, slim module application
  9. Provides full image test after package together with electrical test by using automatic tester

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

OPTOPAC Inc

Country / Year Established
South Korea South Korea / 2003
Membership
BIZ
Business type
Manufacturer

16

TRADE TOWER

DUNS

President
DEOK-HOON KIM
Address
1112-11, Namchon-ri, Oksan-myeon, Cheongwon-gun, Chungcheongbuk-do, 363-911, KOREA
Product Category
Electrical Equipment
Year Established
2003
No. of Total Employees
1-50
Company introduction

OptoPAC Inc that design and develop WLCSP(Wafer Level Chip Scale Package) for CMOS and CCD Image Sensor has been grown as a venture company since Oct 2003. Also OptoPAC is based on the specific patent technologies and know-how in Image Sensor Package fields. We were the first to actualize WLCSP made use of 8" glass wafer based on the specific patent technologies. Finally, we provide our customers with the maximum satisfaction with competitive WLCSP through the price, size and reliability.

Recently, as market of Image Sensor, Camera module is advanced very rapidly, we become competitive with each other for the top of technology and quality within rapid distribution of Camera Phone and Digital Camera over the world. Under this circumstances, we will do our best for providing our customers with reliable products and services as the leader of WLCSP fields based on key technology and research.

Once again I cordially thank you for your visits to the homepage. I would like to ask you a favor that you will utilize our homepage plentifully, also you will continuously cooperate for the homepage.

Main Markets

Hong Kong(China) Hong Kong(China)

U.S.A U.S.A

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