Wafer Boning Machine

Fully Automated Wafer Bonding System


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
South Korea
Brand name
Hutem
Payment Terms
T/T
Production method
OBM
Shipping / Lead Time
Negotiable / Negotiable
Keyword
bonding machine, semiconduct, bonding system, wafer bonder
Category
Electrical Equipment , Other Equipment , Other Machinery & Industry Equipment

HUTEM CO., LTD.

Membership
PRO
Country / Year Established
South Korea South Korea / 2007
Business type
Manufacturer
Verified Certificate

2

DUNS

Product name Wafer Boning Machine Certification -
Category Electrical Equipment
Other Equipment
Other Machinery & Industry Equipment
Material -
Keyword bonding machine , semiconduct , bonding system , wafer bonder Unit Size -
Brand name Hutem Unit Weigh -
origin South Korea Stock 0
Supply type OBM HS code 847990

Product Information

https://www.youtube.com/watch?v=-Y0RRlId6dU




Wafer Bonding Machine

 

 

Optimized equipment for mass-production for wider 8 inch wafer Full Automation equipment with combined unit of Stacker and Aligner. (PRE+FINE)

 

We provide innovative solutions to help customers improve their value.
In particular, we are always striving for the success of our customers by supplying key equipment
necessary for the bio-pharmaceutical and semiconductor industries by providing optimized
technology for efficient production.

We will share the moment of customer success with technology for humans.





 

 

 

 

 

 

[Advantages]

Optimized equipment for mass production

Extended Cluster Type of Process Module for improving production capacity

Wafer bonding equipment for heterogeneous / homogeneous materials

Technology that enables high performance by Wafer integration

 

 

 

 

 

 


 

 

 

[Technical Specification]

• Machine Type : Full-Automation

• Wafer Size : 8inch (Option: 12inch)

• Wafer Type : Si, Sapphire, GaAs, GaN and so on.

• Bonding method : Eutectic, Adhesive, Epoxy, Polymer

• Main module : EFEM, Transfer, Stacker, Pre Aligner, Fine Aligner, Process module

• Process Module docking : Max. 4 PM Extensible

• Wafer Loading to PM Qty : 1 Wafer/PM Loading

• Application Micro LED, Mini LED, FBAR Filter, SAW Filter, CMOS Image Sensor, MEMS, Semiconductor, Acceleration Sensor, Vertical LED

 

 

 

 

 

 

 

 


Product Info Attached File

HBS-800A Series.pdf

B2B Trade

Price (FOB) Negotiable transportation Air Transportation,Negotiation Other,Ocean Shipping
MOQ Negotiable Leadtime Negotiable
Payment Options T/T Shipping time Negotiable

HUTEM CO., LTD.

Country / Year Established
South Korea South Korea / 2007
Membership
PRO
Business type
Manufacturer

2

DUNS

President
HONG-SOO,SHIN
Address
Korea, Seoul, Geumcheon-gu, Gasan digital 2-ro,#302 115, Geumcheon-gu, Seoul, Korea
Product Category
Other Pharmaceutical Packaging
Year Established
2007
No. of Total Employees
1-50
Company introduction

Hutem has continuing to develop Prefilled Syringe Filling & Stoppering machine more than 10years with number of patents and provide total solution for prefilled syringe product from R&D to Mass-productivity and Filling to End-packaging machinery.

 

HUTEM is named based on Human, Technology and Moment and it signify Hutem’s Company Vision and further more our properties are People, Technologies and Speed. Human-oriented Technology-oriented Moment proceed to the successful Those are company philosophy all our employees and partners are persuing.

Main Markets

China China

India India

Russia Russia

Saudi Arabia Saudi Arabia

U.A.E. U.A.E.

Main Product
Attached File

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