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- China / 2009
D-Mode SiN Cap GaN On SiC Epi Wafer Manufacturers
- ◾ Price: Negotiable
- ◾ MOQ: Negotiable
D-Mode SiN Cap GaN On SiC Epi Wafer Manufacturers
- ◾ Price: Negotiable
- ◾ MOQ: Negotiable
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D-Mode SiN Cap GaN On SiC Epi Wafer Manufacturers GaN Cap
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Required Quantity
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Brand name-
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Shipping / Lead TimeNegotiable / Negotiable
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Keyword
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Specifications
| Size | - | Weight | - | Stock | 25 Pieces |
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| Country of Origin | China | ||||
| Production method | Available | ||||
Trade Terms
| Payment Terms | T/T | ||||
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| Price(FOB) | Negotiable | MOQ | Negotiable | ||
| Transportation | Express | ||||
| Lead time | Negotiable | Shipping time | Negotiable | ||
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- BIZ
Business typeManufacturer
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Verified Certificate
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Product Description
As one of global GaN on SiC Epi Wafer Suppliers, HMT usually offer 4'' 6'' and 8'' AlGaN/GaN on SiC Epi Wafer with SiN cap, GaN cap or pGaN Cap. We have both D-Mode and E-Mode and RF structure for GaN on SiC.
GaN-on-SiC epi wafers combine the high electron mobility of GaN with the superior thermal conductivity of SiC, making them ideal for:
High-power RF applications (e.g., radar, 5G base stations)
Power electronics (e.g., EV inverters, fast chargers).
Aerospace & defense systems (e.g., phased-array radars, satellite comms)
Key Advantages:
✔ Higher power density (vs. GaN-on-Si or LDMOS).
✔ Better thermal management (SiC’s thermal conductivity ≈ 3x Si).
✔ Wider bandgap (3.4 eV for GaN, 3.3 eV for SiC), enabling high-voltage operation.
As one of global GaN on SiC Epi Wafer Suppliers, HMT usually offer 4'' 6'' and 8'' AlGaN/GaN on SiC Epi Wafer with SiN cap, GaN cap or pGaN Cap. We have both D-Mode and E-Mode and RF structure for GaN on SiC.
GaN-on-SiC epi wafers combine the high electron mobility of GaN with the superior thermal conductivity of SiC, making them ideal for:
High-power RF applications (e.g., radar, 5G base stations)
Power electronics (e.g., EV inverters, fast chargers).
Aerospace & defense systems (e.g., phased-array radars, satellite comms)
Key Advantages:
✔ Higher power density (vs. GaN-on-Si or LDMOS).
✔ Better thermal management (SiC’s thermal conductivity ≈ 3x Si).
✔ Wider bandgap (3.4 eV for GaN, 3.3 eV for SiC), enabling high-voltage operation.








